Dirac Research, the Sweden-based company specializing in digital sound optimization solutions, today announced they’re showing off the latest version of its Dirac 3D Audio at Mobile World Congress (MWC) next week.
With its high-end 3D audio solution the company is admittedly appealing primarily to discerning mobile manufacturers in a rapidly approaching reality of 5G ahead of us, although Dirac 3D Audio is also targeting PC headphone makers and VR/AR headset manufacturers too.
In virtual reality, audio oftentimes takes a backseat to immersive visuals, however Dirac is working to create more articulated audio with its newest 3D Audio solution, which is said to bring positional audio reproduction “with one degree of resolution in all three dimensions.”
Based on the company’s patent-pending Dynamic HRTFs (head-related transfer functions)—something created to account for movements of the head in relation to the human torso—Dirac 3D Audio aims to bring positional audio to users with a high degree of realism, minimum distortion, and errors.
Dirac has previously worked with leading mobile device manufacturers including Huawei, Xiaomi, OPPO, OnePlus and Motorola. The technology has also been recently adopted by Tritton’s Kunai Pro gaming headphones for PC.
The newest Dirac 3D Audio solution will be showcased at MWC 2019 in Barcelona, Spain next week, and will be demoed using a VR headset and a smartphone.
We’ll have feet on the ground in Barcelona next week to see just how it stacks up to integrated methods created by platform holders such as Valve and Oculus.
The post Dirac to Debut Its Latest 3D Audio Solution at MWC 2019 Next Week appeared first on Road to VR.
Ream more: https://www.roadtovr.com/dirac-debut-latest-3d-audio-solution-mwc-2019-next-week/
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